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FabFTDI

FabFTDI

Using At45 8 pins, VCC, GND, RST,   FTDI cable pinout – 6 pins, VCC, GND, RxD, TxD, RTS, CTS (all signal TLL)   USB connector: PIN1 – VCC, PIN2 – D-, PIN3-D+, PIN4-GND D- is pulled up by 15K resistor.   Trace near USB-B […]

SPTS Deep Reactive Ion Etching

SPTS Deep Reactive Ion Etching

For Etching Si using Bosch switched processing for vertical profiles. For Etching Si using non-switched processing for tapered profiles. The Electro-Static Clamping Chuck enables good wafer clamping, less wafer bowing compared with mechanical clamping, and wafer-less chamber cleaning. Chuck temperature from -20°C to + 40°C. […]

STS Inductively Coupled Plasma (ICP) RIE-8

STS Inductively Coupled Plasma (ICP) RIE-8

Inductively Coupled Plasma Reactor that is used for Reactive Ion Etch. High plasma density, low operating pressure, high etch rate, excellent etch uniformity and low energy ion damage. Temperature to be controlled from 5 to 30oC. Restricted to etch silicon-based materials, which include Si, SiO2, […]

EVG 620 Mask Aligner

EVG 620 Mask Aligner

Topside(TSA) and Backside(BSA) alignment. Achievable exposure resolution ~1 um, alignment resolution ~ 1.5um. Only 6” wafer. Able to perform soft, hard, low vacuum and vacuum contact, as well as proximity exposure. Restricted to positive-tone photoresists (for this system only).

Suss MJB4 Mask Aligner

Suss MJB4 Mask Aligner

Up to 4 inch wafer. The achievable adjustment accuracy X, Y and theta is below 1 um. Masks and wafer/substrates to a total thickness of 9.00 mm can be processed. Equipped with 400 nm exposure optics and lamps that allow a sub-micro exposure in vacuum contact […]

MLA150 Direct-write Lithography System
uPG501 Direct-Write Lithography System
Quantum Dot Transistor

Quantum Dot Transistor

Quantum Dot Transistor

Vacuum Channel Transistor

Vacuum Channel Transistor

Vacuum channel transistor.